This position will investigate and develop new microelectronic technologies and processes. In addition to new development work, this position is also responsible for improvements of existing assembly processes. This involves developing, prototyping, implementing and improving new thick film ceramic substrate, hybrid assemblies and PCB/flexible circuit surface mount assembly manufacturing processes required for both new product introductions and existing products. This position is both a hands-on working engineering position and a leadership position getting work done through othersLong Description